Monday, 26 March 2012

IBM Power 7+ Pictured | Technology News

IBM is still the king of the pack as they are for the last ten years. They were the first to market with a really great module MCM "bubble memory" back in the 70s, a server design using their immense Power5 MCM architecture in 2003, and now they are back with new packaging technology.

On Friday, a camera of Charlie Demerjian from Semi Accurate made ​​IBM eyes new baby, completely exposed.

The chips represented here are part of the POWER7 + new family and they are, from left to right: four P7 + CPU die to an intervention without a lid, four P7 + CPU die with organic packaging, even without a lid, and right, an unspecified said current stacked with and without the heat spreader.

No one else can now demonstrate such technology on a large scale, so that IBM is again at the forefront of the design of silicon integrated circuits.

It is said that the joints between an active part of the inclusion of large amounts of ERAM communicating over a very large bandwidth.

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